Exhibition & Exhibitor Report: NEPCON JAPAN 2014

NEPCON JAPAN 2014 (the 43rd INTERNEPUCON JAPAN, the 31st ELECTROTEST JAPAN, 15th IC PACKAGING TECHNOLOGY EXPO, ELE EXPO-15th ELECTRONIC COMPONENTS EXPO, PWB EXPO–15th Printed Wiring Boards Expo, MATERIAL JAPAN–5th Advanced Electronic Materials Expo, MicroTech JAPAN–4th Micro Fabrication / Fine Process Technology Expo) is the biggest exhibition about the electronics implementation, production and technique in Asia. Record-high 1780 companies exhibit from 16 countries of the world. As co-exbhition, AUTOMOTIVE WORLD 2014 (CAR-ELE JAPAN-6th Int’l Automotive Electronics Technology Expo, EV JAPAN-5th EV & HEV Drive System Technology Expo, 4th Automotive Weight Reduction Expo, 2nd Connected Car JAPAN) and LIGHTING JAPAN 2014 (6th LED/OLED Lighting Technology Expo, 4th LED/OLED Light Expo, DESIGN LIGHTING TOKYO 2014 -2nd TOKYO DESIGN LIGHTING EXPO & CONFERENCE-) is held. A session is three days from Wednesday, January 15, 2014 to Friday, January 17. The venue is Tokyo Big Sight.

The official homepage of NEPCON JAPAN 2014 is below:http://www.nepconjapan.jp/

Non-contact three dimensions tester “Zebra Qubic Mini” – NIKKE Machine Manufacturing Corporation

High Speed Modular Mounter「EXCEN PRO」 – SAMSUNG TECHWIN Co.,Ltd.

Illumination to control with a smartphone: “hue” – Philips electronics Japan Co., Ltd.

Layered piezo parts feeder – DAISHIN Co., Ltd.

High pressure pulse spray washing machine “DDPC” – KAIJO CO,.Ltd.